DPA (Destructive Physical Analysis), CA (Construction Analysis), FA (Failure Analysis), Risk Mitigation.
Material science
Electrical Components
Circuit boards
Mechanical Components
X-Ray in house with X-Plane Technology
CSAM (C Mode Scanning Acoustic Microscopy)
FTIR (Fourier Transform Infrared Spectroscopy)
SEM (Scanning Electron Microscope)
Decapsulation mechanical or chemical
PCB testing
XRF X-Ray Fluorescence testing for solder
Solderability testing
Inspection per IPC standards
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